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ExposedPad™ SOIC / SSOP
 This Amkor-developed family of power IC packages significantly increases the thermal efficiency of power-constrained standard SOIC and SSOP packages. The ExposedPad™ SOIC / SSOPs can increase heat dissipation by as much as 110% over standard packages, thereby expanding the margin of operating parameters. Additionally, the ExposedPad™ can be connected to ground, thereby reducing loop inductance for high frequency applications. The ExposedPad™ should be soldered directly to the PCB to realize the thermal and electrical benefits.
Applications:
Increased end-application densities and shrinking product sizes demand more from IC packages. ExposedPad™ SOIC / SSOPs give designers the needed margin for designing and producing high performing products such as telecom, disk drives, pagers, wireless, CATV / RF modules, radio and other similar applications. GaAs and hi-speed silicon technologies work especially well in ExposedPad™ SOIC / SSOP packages due to added shielding and grounding capabilities.
Features:
Exceptional performance through the innovative design of ExposedPad™ SOIC / SSOPs offer:
- 8 and 16 lead count for ePad SOIC
- 16 lead count for ePad SSOP
- Reduced standoff height compared to standard SOIC / SSOP
- Increased thermal efficiency:
- 3.25 watt power handling capability for ePad 20LD SSOP, 0.75 watt for standard 20 LD SSOP
- Solder plated exposed metal die pad
- Up to 60% improvement in Theta JA (compared to a standard SOIC / SSOP)
- Highly conductive copper leadframe
- JEDEC MRT Level 3 without Down-bond
- Low cost-effective solution than PowerSOP® and SSOP
- All leads electrically active
Thermal Resistance:
Multi-Layer PCB
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Theta JA (°C/W)
by Velocity (LFPM) |
| Pkg |
Body Size (mm) |
Pad Size |
0 |
200 |
500 |
| SSOP 16 ld |
155 x 194 |
96 x 90 |
44.3 |
38.5 |
36.1 |
| SOIC 8 ld |
155 x 194 |
90 x 90 |
58.6 |
52.1 |
49.4 |
Reliability:
IC chips are assembled in optimized package designs with proven reliable semiconductor materials.
| Moisture sensitivity characterization: |
JEDEC Level 3 minimum, 30°C / 60% RH, 192 hours |
| Temp / Humidity: |
85°C / 85% RH, 1000 hours |
| PCT: |
121°C, 2 atm, 504 hours |
| High temp storage: |
150°C, 1000 hours |
| Temp cycle: |
-65 / +150°C, 1000 cycles |
Process Highlights:
| Die Thickness: |
14 ± 2 mils |
| Solder plating: |
85 / 15 Sn / Pb |
| Marking: |
Laser |
| Bond pad pitch: |
0.08 mm |
| Wire diameter: |
1.0 / 2.0 mil |
| Coplanarity (max): |
3 mil |
| Pack/ship options: |
Bar Code, Dry Pack, Tape & Reel |
Test Services:
- Program generation / conversion
- Product engineering support
- Wafer sort
- 256 pin x 20 MHz test system available
- Burn-in
- Tape and reel services
- Ambient to +165°C test available
Shipping:
- Clear anti-static tube (20 inch)
Additional Information:
| Description |
File Type |
File Size |
| ExposedPad™ SOIC / SSOP Data Sheet |
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124 kb
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For more information on the ePad™ SOIC / SSOP package, please contact an Amkor Regional Sales Office near you, your Account Manager or fill out the Request for Additional Information Form.
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