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ExposedPad™ LQFP / TQFP
 This Amkor-developed family of power IC packages significantly increases the thermal efficiency of power constrained standard LQFP
and TQFP packages. The ExposedPad™ LQFP / TQFP can increase heat dissipation by as much as 110% over a standard LQFP / TQFP,
thereby expanding the margin of operating parameters. Additionally, the ExposedPad™ can be connected to ground, thereby reducing
loop inductance for high frequency applications. The ExposedPad™ should be soldered directly to the PCB to realize the thermal and electrical benefits. 3D packaging with die stack process are also provided in this package for MCP solution.
Applications:
Increased end-application densities and shrinking product sizes demand more from IC packages. ExposedPad™ LQFP / TQFPs give
designers the needed margin for designing and producing high performing products such as telecom, magnetic / optical disk drives, pagers, wireless,
CATV / RF modules, LCD / flat panel TVs, radio and other similar applications. GaAs and hi-speed silicon technologies work especially well in
ExposedPad™ LQFP / TQFP packages due to added shielding and grounding capabilities.
Features:
Amkor’s ExposedPad™ QFP / TQFP IC package portfolio provides:
- 5 x 5 mm to 28 x 28 mm body size
- 32 to 256 lead counts
- Broad selection of die pad sizes
- Double down-set ground bond ring pad
- Copper leadframes
- 1.0 mm body thickness for TQFP
- 1.4 mm body thickness for LQFP
- Custom leadframe design available
- ExposedPad™ is easily inverted for heat sink attach
- Low Profile - < 1.2 mm max mounted height
- Electrical - Very low loop inductance with use of paddle as ground path, more pins available for signal and allows for operating frquencies of up to 2.4 GHz
Thermal Resistance:
Multi-Layer PCB, JEDEC Standard Test Boards, Tested @1 W, With die attach pad soldered to PCB
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Theta JA (°C/W)
by Velocity (LFPM) |
| Pkg |
Body Size (mm) |
Pad Size |
0 |
200 |
500 |
| 32 ld |
5 x 5 |
3.4 x 3.4 |
34.6 |
29.1 |
27.2 |
| 48 ld |
7 x 7 |
5 x 5 |
27.6 |
22.6 |
20.7 |
| 64 ld |
10 x 10 |
7.5 x 7.5 |
22.3 |
17.2 |
15.1 |
| 100 ld |
14 x 14 |
10.3 x 10.3 |
20.6 |
15.3 |
13.4 |
| 144 |
20 x 20 |
7 x 7 |
20.0 |
15.4 |
13.5 |
| *176 |
24 x 24 |
10 x 10 |
19.0 |
15.4 |
13.5 |
| *208 |
28 x 28 |
11 x 11 |
18.7 |
15.5 |
14.0 |
Reliability:
IC chips are assembled in optimized package designs with proven reliable semiconductor materials.
| Moisture sensitivity Characterization: |
JEDEC Level 3, 30°C / 60% RH, 192 hours - 3x reflow - SAT |
| Temp / Humidity: |
85°C / 85% RH, 1000 hours |
| HAST w/ precon: |
130°C / 85% RH, 96 hours |
| High temp storage: |
150°C, 1000 hours |
| Temp cycle w/ precon: |
-65 to + 150°C, 1000 cycles |
Process Highlights:
| Die Thickness for TQFP: |
18 ± 2 mils |
| Die Thickness for LQFP: |
24 ± 2 mils |
| Lead finish : |
85 / 15 Sn/Pb, 100% Matte Sn
Pre-plated leadframe capa is selectively available |
| Marking: |
Laser |
| Bond pad pitch: |
0.050 mm |
| Wire diameter: |
1.0 mil or 0.8 mil |
| Wafer backgrinding: |
Available |
| Pack/ship options: |
Bar code, dry pack |
Test Services:
- Program generation / conversion
- Product engineering support
- Wafer sort
- 256 pin x 20 MHz test system available
- Burn-in
- Tape and reel services
- -55°C to +165°C test available
Shipping:
- JEDEC outline CS-007 low profile tray
Additional Information:
| Description |
File Type |
File Size |
| ExposedPad™ LQFP / TQFP Data Sheet |
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559 kb |
| FusionQuad™ Data Sheet |
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319 kb
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For more information on the ePad™ LQFP / TQFP package, please contact an Amkor Regional Sales Office near you, your Account Manager or fill out the Request for Additional Information Form.
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