Amkor's Enhanced PBGA (EPBGA) a cavity down package that offers excellent thermal performance (up to 7 watts) by attaching the IC directly to an integrated copper heat spreader. With improved electrical and thermal performance, Amkor's EPBGA makes it an ideal solution for high-performance applications such as microprocessors / controllers, DSPs, ASICs, gate arrays, memory and PC chip sets.

This technology is especially applicable for high-performance applications such as microprocessors, controlles, DSPs, ASICs, gate arrays, memory, PC chip sets and other advanced end applications. 

For more information on the Enhanced PBGA package, please contact an Amkor Regional Sales Office near you, your Account Manager or fill out the Request Information Form.