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ChipArray® BGA (CABGA / LFBGA)
Thin ChipArray® BGA (CTBGA / TFBGA)
Very Thin ChipArray® BGA (CVBGA / VFBGA)
 Amkor’s ChipArray® packages are laminate based Ball Grid Array (BGA) packages that are compatible with established SMT mounting processes. The near-chip-size standard outlines offer a broad selection of ball array pitch, count, and body sizes. (See table below) In addition to the standard core ChipArray package (CABGA), Amkor offers thin core ball grid array packages (CTBGA and CVBGA) which, coupled with a thin mold cap, achieve package thicknesses down to 1.0 mm max. By utilizing a thin core laminate, much denser routing can be achieved, thereby enabling more I/Os in a given footprint. Amkor ChipArray packages, regardless of body size and thickness, utilize the same, flexible capacity which assures economical packaging solutions. Further, high volume processes and innovative design assure high quality and cutting edge technology. Due to their small size and I/O density, Amkor’s ChipArray product family is an excellent choice for new devices requiring a small footprint size and low mounted height.
Applications:
The ChipArray package family is applicable for semiconductors such as memory, analog, ASICs, RF devices and simple PLDs requiring a smaller package size than conventional PBGAs. ChipArray packages fill the need for low cost, minimum space and high speed requirements of mobile phones and pagers, notebook and subnotebook personal computers, PDAs and other wireless systems.
Features:
Cutting edge technology and expanding package offerings provide a platform from prototype-to-production.
- Full, in-house design
- Square or rectangle packages available
- 3 mm to 21 mm body size available (CABGA)
- 3 mm to 19 mm body size available (CTBGA and CVBGA)
- 8 to 600 ball counts
(CABGA)
- 36 - 500 ball counts (CTBGA and CVBGA)
- 0.5, 0.65, 0.75, 0.80 & 1.0 mm ball pitch available
- JEDEC MO-216 compliant for 0.8 mm and 1.0 mm ball pitch
- JEDEC MO-195 compliant for 0.5 mm & 0.65 mm ball pitch
- PB free and Green package available
- Daisy Chain packages available
- Short traces for excellent electrical inductance
- Low inductance (modeled data) :
- 1.4nH (1.0 mm trace length)
- 4.1nH (5.0 mm trace length)
Mechanical Samples:
For mechanical samples of our ChipArray® BGA package, please click here.
For mechanical samples of our CVBGA package, please click here.
For mechanical samples of our CTBGA package, please click here.
Thermal Resistance:
Theta JA at 1.0 Watt and 0 airflow (°C/Watt)
Body Size (mm) |
CABGA |
CTBGA |
CVBGA |
8 x 8 |
37.28 |
36.45 |
37.52 |
10 x 10 |
19.86 |
29.04 |
26.7 |
11 x 11 |
29 |
N/A |
N/A |
15 x 15 |
20.1 |
N/A |
N/A |
19 x 19 |
17.04 |
N/A |
N/A |
Reliability:
Amkor assures a reliable performance by continuously monitoring key indices:
| Moisture sensitivity characterization: |
JEDEC Level 2 @ 240°C / JEDEC Level 3 @ 260°C 8°C / 85% RH, 168 hours |
| HAST: |
130°C / 85% RH, 96 hours |
| Temp Cycle: |
-55 / +125°C, 1000 cycles |
| Temp / Humidity: |
85°C / 85%, 1000 hours |
| High temp storage: |
150°C, 1000 hours |
Process Highlights:
| Die thickness (max): |
0.27 mm (10.5 mils) |
| Bond pad pitch (min): |
50 µm (2 mils) |
| Marking: |
Laser |
| Ball inspection: |
Optical |
| Wafer backgrinding: |
Available |
| Pack options: |
Dry pack |
Standard Materials:
| Package Substrate |
|
| -Conductor: |
Copper |
| -Dielectric: |
Epoxy polyimide blend |
| Die attach adhesive: |
Low stress elastomer |
| Encapsulant: |
Epoxy mold compound |
| Solder ball: |
Eutectic SnPb/Pbfree |
Test Services:
- Program Generation / Conversion
- Product Engineering
- Wafer sort
- 256 Pin x 20 MHz test system available
- -55°C to +165°C Test available
- Burn-in
Shipping:
Cross Section:
CABGA Standard Package Offering:
Ball Pitch |
1.0 |
0.80 |
0.75 |
0.65 |
0.50 |
Body Size |
Ball Count |
Ball Count |
Ball Count |
Ball Count |
Ball Count |
4 |
16 |
|
|
|
49 |
4 |
|
|
|
|
40 |
5 |
|
25 |
|
|
40 |
5 |
|
|
|
|
57 |
6 |
|
36 |
|
|
48 |
6 |
|
49 |
|
|
56 |
6 |
|
|
|
|
64 |
6 |
|
|
|
|
84 |
7 |
|
48 |
44 |
81 |
104 |
7 |
|
49 |
46 |
|
108 |
7 |
|
64 |
48 |
|
64 |
7 |
|
|
64 |
|
84 |
7 |
|
|
48 |
|
96 |
8 |
42 |
64 |
|
105 |
108 |
8 |
|
72 |
|
111 |
132 |
8 |
|
81 |
|
113 |
144 |
8 |
|
94 |
|
96 |
|
9 |
64 |
100 |
48 |
124 |
|
9 |
|
72 |
64 |
|
|
9 |
|
80 |
|
|
|
9 |
|
81 |
|
180 |
180 |
CTBGA Standard Package Offering:
Ball Pitch |
1.0 |
0.80 |
0.65 |
0.50 |
Body Size |
Ball Count |
Ball Count |
Ball Count |
Ball Count |
10 |
81 |
100 |
|
192 |
10 |
|
96 |
|
241 |
10 |
|
120 |
|
181 |
10 |
|
121 |
|
277 |
10 |
|
144 |
|
|
10 |
|
97 |
|
|
11 |
100 |
109 |
200 |
223 |
11 |
97 |
128 |
|
|
11 |
|
169 |
|
|
12 |
112 |
144 |
208 |
228 |
12 |
121 |
160 |
|
288 |
12 |
|
196 |
|
|
13 |
108 |
200 |
277 |
289 |
13 |
144 |
224 |
|
320 |
13 |
|
225 |
|
417 |
14 |
|
192 |
300 |
287 |
14 |
|
192 |
|
|
CTBGA Standard Package Offering:
Ball Pitch |
1.0 |
0.80 |
0.65 |
0.50 |
Body Size |
Ball Count |
Ball Count |
Ball Count |
Ball Count |
10 |
81 |
100 |
|
192 |
10 |
|
96 |
|
241 |
10 |
|
120 |
|
181 |
10 |
|
121 |
|
277 |
10 |
|
144 |
|
|
10 |
|
97 |
|
|
11 |
100 |
109 |
200 |
223 |
11 |
97 |
128 |
|
|
11 |
|
169 |
|
|
12 |
112 |
144 |
208 |
228 |
12 |
121 |
160 |
|
288 |
12 |
|
196 |
|
|
13 |
108 |
200 |
277 |
289 |
13 |
144 |
224 |
|
320 |
13 |
|
225 |
|
417 |
14 |
|
192 |
300 |
287 |
14 |
|
192 |
|
|
CVBGA Standard Package Offering:
Ball Pitch |
1.0 |
0.80 |
0.65 |
0.50 |
Body Size |
Ball Count |
Ball Count |
Ball Count |
Ball Count |
15 |
160 |
208 |
|
256 |
15 |
176 |
273 |
|
|
15 |
196 |
324 |
|
|
15 |
144 |
|
|
|
16 |
|
280 |
324 |
|
16 |
|
285 |
|
|
17 |
176 |
256 |
|
|
17 |
208 |
272 |
|
|
17 |
224 |
280 |
|
|
17 |
228 |
292 |
|
|
17 |
252 |
316 |
|
|
17 |
256 |
|
|
|
19 |
280 |
288 |
|
|
19 |
289 |
|
|
|
19 |
324 |
|
|
|
21 |
256 |
449 |
|
287 |
21 |
272 |
|
|
|
21 |
336 |
|
|
|
21 |
336 |
|
|
|
21 |
400 |
|
|
|
Additional Information:
| Description |
File Type |
File Size |
| CABGA / CTBGA / CVBGA Data Sheet |
|
502 kb
|
For more information on the CABGA, CTBGA or the CVBGA package, please contact an Amkor Regional Sales Office near you, your Account Manager or fill out the Request for Additional Information Form. |
|
