Amkor's Tape-SuperBGA technology combines SBGA thermal performance with the benefits of one metal layer flexible circuit tape. Like the SBGA package, Tape-SuperBGA offers a high-power solution for design engineers with the additional benefits of low profile and cost effectiveness in a cavity down package.

Applications:

This technology is especially applicable for your high-speed, high-power semiconductors, such as ASICs, Microprocessors, Graphic Chips, DSP and FPGA requiring high-performance packages. HPBGA technology fills the demand for high-speed, high-power, and space requirements of High end workstations, servers, data communications, PLDs (Programable Logic Devices), Cable modem controllers, digital set-top boxes (STB), internet routers and other advanced end applications.

Features:

• Custom packages in body sizes ranging from 23 x 23 mm to 45 x 45 mm
• 1.0 & 1.27 mm ball pitches available
• Ball counts ranging from 168 to 1036
• 1-Metal layer tape + Cu heat spreader
• Superior thermal performance - 10% better than the SBGA
• Enhanced electrical performance > 1 GHz
• Excellent reliability
• Low Profile (1.40 mm mounted)
• Light weight
• Excellent routability:
  • 25 / 25 µm Trace width / trace space
  • Supports 1.0mm Pitch and facilitates up to 7 ball rows
• Quickest design-to-prototype delivery

Process Highlights and Standard Materials:

Wafer Mount:	UV Tape
Wafer Diameter:	4, 5, 6, 8 Inches
Target Wafer Thickess:	356 µm +/-51 µm
Saw and Clean:	CO2 Bubbler
Die Attach/Cure:	AMK-02 / 150°C, 30 min.
Substrate:	Single metal layer polyimide tape
Wire Bond:	0.8, 1.0, mil dia., Au
Solder Balls:	63 Sn / 37 Pb
Encapsulation/Cure:	Hysol 4450SF / 110°C, 1 hour
Marking:	Laser / Ink
Pack / Ship Options:	JEDEC trays / Dry Pack Optional

TapeSBGA Cross Section View

For more information on the Tape-SuperBGA package, please contact an Amkor Regional Sales Office near you, your Account Manager or fill out the Request for Additional Information Form.