With the evolution of smaller, denser, faster and lighter end products, Amkor not only shrunk the SOP by decreasing the lead pitch, but also made it thin - 0.9 mm thin! Amkor invested time and research into assuring quality and reliability with advanced designs, assembly equipment/ processes and materials. The result is controlled package flatness, wire sweep, solderability and delamination resistance.

Amkor now makes it possible for IC designers, packaging engineers, circuit designers and component specifiers to work concurrently and succeed with its TSSOP product line.

For more information on the TSSOP package, please contact an Amkor Regional Sales Office near you, your Account Manager or fill out the Request Form.