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Small Outline IC (SOIC)
 Amkor has a broad portfolio of Small Outline ICs (SOIC) packages, including .150”, .208” and .300” body sizes. Statistically controlled and refined assembly processes coupled with very high quality materials assure the best SOIC packages available for your semiconductor devices. These IC packages have proven surface mount (SMT) performance characteristics and have been designed to adapt easily to all SMT processes and lines. Amkor’s wide array of SOIC packages provide component and packaging engineers the ability and freedom to optimize systems and product designs. Standard materials for Amkor’s SOIC package family meet the requirements for RoHS, (Pb-free and Green).
Applications:
Whether you’re working with resistors networks, discrete semiconductors or ICs, Amkor’s SOIC package product lines will serve the needs of various semiconductor technologies with ease. End products range from consumer (audio, video, entertainment), telecom (pagers, cordless telephone), RF/wireless (PC cards, RF/CATV, telemetry), office (fax, copier, printer), PC/peripheral, automotive and other applications.
Features:
Amkor’s SOIC / SOJ packages offer:
- 8 - 32 lead counts
- 150, 208, and 300 mil body sizes
- 50 mil lead pitch
- Broad selection of open tooled leadframes offering a selection of pad sizes
- High-conductivity copper leadframes
- JEDEC compliant package outlines
- Solder plate (Pb-Sn, Sn-Bi, Matte Sn) or pre-plate (NiPdAu) lead-finish options
- “J” and “gullwing” leadform selection
- Strip Test with New Matrix (High Density) Leadframe
Thermal Resistance:
Single-Layer PCB, Pre-JEDEC Standard Test Boards
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Theta JA (°C/W) by Velocity |
| Pkg |
Body Size (mm) |
Pad Size (mm) |
0 |
200 |
500 |
| 8 ld |
4.9 x 3.8 |
2.3 x 2.3 |
153.3 |
128.5 |
115.5 |
| 20 ld |
12.8 x 7.6 |
5.1 x 4.1 |
83.2 |
65.7 |
57.5 |
| 28 ld |
7.6 x 18.0 |
5.6 x 6.4 |
76.2 |
60.8 |
53.2 |
Multi-Layer PCB, Pre-JEDEC Standard Test Boards
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Theta JA (°C/W) by Velocity |
| Pkg |
Body Size (mm) |
Pad Size (mm) |
0 |
200 |
500 |
| 8 ld |
4.9 x 3.8 |
2.3 x 2.3 |
112.7 |
103.3 |
97.1 |
| 28 ld |
7.6 x 18.0 |
5.6 x 4.1 |
46.2 |
39.7 |
36.8 |
Reliability:
Amkor subjects their SOIC packages to high level testing to assure reliable performance.
| Temp cycle: |
-65 / +150°C, 500 cycles |
| HAST: |
130 °C / 85% RH, no bias 96 hours |
| High temp storage: |
150°C, 1000 hours |
Process Highlights:
| Die Thickness (max): |
(150 mil wide) 16 mil max |
| Die Thickness (max): |
(300 mil wide) 25 mil max |
| Strip Marking: |
Laser |
| Lead inspection: |
Optical |
| Pack/ship options: |
Bar code, tube/box, tape/reel |
| Bond pad pitch: |
90 micron standard |
| Coplanarity (max): |
0.003 inch |
Standard Material:
| Leadframe Alloy: |
C194 |
| Die Attach Material: |
Ablestik 8290 |
| Gold Wire: |
0.8 - 1.2 mil diameter |
| Mold Compound: |
Sumitomo G600 |
| Lead Finish: |
Matte Sn or NiPdAu |
Test Services:
Contact Amkor Test Services for more details.
- Program generation / conversion
- Product engineering support
- Wafer sort
- Ambient to +165°C test available
- Strip based testing available
- Tape and reel services
- Burn-in
Shipping:
- Clear Anti-static (Tube 20 inch)
Additional Information:
| Description |
File Type |
File Size |
| SOIC Data Sheet |
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365 kb
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For more information on the SOIC package, please contact an Amkor Regional Sales Office near you, your Account Manager or fill out the Request for Additional Information Form. |
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