This Amkor-developed family of power IC packages significantly increases the thermal efficiency of power constrained standard SOIC packages. The PowerSOP (PSOP) improves Theta JA up to 50% over a standard SOIC thereby expanding the margin of operating parameters. The large integrated exposed copper heatslug to which the IC chip is directly attached results in an increased ability to dissipate heat. The leadframe and heatslug are mechanically attached, leaving the leads electrically isolated. The package is offered in a low stand-off (.002) heatslug down version, which is MS-012, MS-013, or MO-166 JEDEC compliant depending on the package you choose. These flexibilities still allow maximum thermal management by directly soldering the slug to the PCB. Furthermore, there are two types of PSOPs (2 and 3) available with various features and benefits to address different market application needs.

Applications:

Increased end-application densities and shrinking product sizes demand more from IC packages. PSOPs give designers the needed margin for designing and producing high performing products such as telecom, disk drives, pagers, wireless, CATV / RF modules, radio, automotive / industrial and other similar applications. GaAs, SiGe and hi-speed silicon technologies work especially well in PSOP packages due to added shielding and grounding capabilities.

Features:

Exceptional performance through the innovative design of PSOPs offer:

• Up to 50% improvement in Theta JA when slug soldered to board
• Highly conductive copper heatslug and leadframes
• Optional PSOP assembly materials for enhanced power capability include soft solder die attach
• Available in:
        - PSOP 2: (.150" body) - 8, 16 lead; (.300" body) - 16, 20, 24, 28 lead
        - PSOP 3: (11 x 15.9 mm body) - 20, 24, 30, 36, 44 lead
        - PSSOP: (.150" body) - 16, 28 lead

Reliability:

IC chips are assembled in optimized package designs with proven reliable semiconductor materials.

Process Highlights:

Test Services:

Contact Amkor Test Services for more details.

Shipping:

Configuration Options:

Additional Information:

Description	File Type	File Size
PSOP 2 & 3 Data Sheet		482 kb

For more information on the PSOP package, please contact an Amkor Regional Sales Office near you, your Account Manager or fill out the Request for Additional Information Form.