Amkor's PLCC offerings cover the total range offered by the industry. It includes all square body packages from 20 lead through 84 lead. Also included is the rectangular body format of the 32 lead. All PLCC products are offered with and without heatspreaders. The heatspreader versions are identical in form factor to the standard non-heatspreader versions. Both versions are JEDEC compliant in all respects. The heatspreader versions give the system designer greater latitude in thermally enhanced board level and/or system design. All products utilize the most advanced manufacturing equipment offered today. Leadfree and green material sets are qualified.

Applications:

Amkor's PLCC product family was engineered to meet JEDEC requirements for "J" leaded surface mount packages. As such, they take up less board space than equivalent "gull" formed product in the same body size. Due to the flexibility and performance offered, most industry circuit types can be designed into the product. This would include memory, processors and controllers, ASIC, DSP, PC chip set; etc., to name a few. Applications range from consumer through automotive and aerospace.

Features:

Amkor’s PLCC IC package portfolio provides:

• .352” x .352” to 1.152” x 1.152” body size
• 20 to 84 lead counts
• JEDEC standard compliant
• Available with heatspreader option
• Fine pitch wire bond capability

Thermal Resistance:

Multi-Layer PCB, (*With Drop-in heatspreader option Tested @ 1W)

Theta JA (°C/W) by Velocity

Pkg	Body Size (mm)	Pad Size	0	200	500
44 ld	16.6 x 16.6	7.8 x 7.8	30.0	24.5	22.0
44 ld*	16.6 x 16.6	7.8 x 7.8	24.4	19.0	16.6

Reliability:

Amkor’s PLCCs are reliability assured through optimized design, material and process enabling high performance operation of your IC chip.

Moisture sensitivity characterization:	JEDEC Level 3,  30°C / 60% - 192 hrs, SAT-192 hrs
Temp / Humidity:	85°C / 85% RH, 1000 hours
PCT:	121°C, 2 atm, 100% RH, 504 hours
High temp storage:	150°C, 1000 hours
Temp cycle:	-65/150°C, 1000 cycles

Process Highlights:

Die Thickness (max):	25 mils
Strip Solder plating:	85/15 Sn/Pb or 100% Sn
Strip Marking:	Laser/pad/offset
Bond pad pitch:	0.07 mm
Lead inspection:	Optical
Pack/ship options:	Bar code

Test Services:

• Program generation / conversion
• Product engineering support
• Wafer sort
• 256 pin x 20 MHz test system available
• Burn-in
• -55 °C to +165 °C test available

Shipping:

• Clear antistatic tube (20 inches)

Configuration Options:

Additional Information:

Description	File Type	File Size
PLCC Data Sheet		321 kb

For more information on the PLCC package, please contact an Amkor Regional Sales Office near you, your Account Manager or fill out the Request for Additional Information Form.