Systems and applications that operate at moderate levels of power need more power performance than QFPs can deliver. Amkor has developed a low cost package system, available in QFP format, to solve these thermal problems. Improved power dissipation is achieved by using an exposed copper heatslug. This large, highly efficient copper heatslug readily extracts generated heat from the leadframe/chip pad to which the IC is attached. Thermal resistance improvements of approximately 80% (over a standard QFP) can be realized with this IC package without the use of any external cooling aids! Finally, the PowerQuad^® 4 heatslug has a built-in mechanical package-encapsulant "lock" feature to ensure package integrity and eliminate moisture penetration. The end result is a moderate power, IC package with the properties to enable new electronic products and emerging end applications to operate with greater features and reliability.

Applications:

PowerQuad^® 4 provides today's semiconductor ICs a package to operate at the speeds and power they were designed. This is why major semiconductor packaging engineers and manufacturers have chosen PowerQuad^® 4 as the IC package of choice for DSPs, PLDs, microprocessors, microcontrollers, high-speed logic / FPGAs, ASICs, digital signal processor (DSP), automotive devices, thin low airflow high perfomrance applications and other similar technologies requiring moderate power management. System designers and OEM product developers find PowerQuad^® 4 to solve power / thermal / speed concerns while supporting system constraints (standard package outlines, cost, SMT capability, product availability, technical support) in uses like: PCs, notebooks, high-end audio/video, power supplies, CPU board systems, workstations, RISC engine modules and many other similar applications.

Features:

Amkor's MQFP PowerQuad^® 4 thermal handling capabilities are supported by these additional attributes:

• Large highly conductive copper heatslug
• ~80% improvement in Theta JA over standard MQFP
• Available in JEDEC-standard packages
• 28 x 28 mm and 32 x 32 mm body size
• 120 - 256 lead counts
• Broad open-tooled leadframe portfolio
• Highly reliable material set
• Solid copper heat slug up and down configurations available
• 50% reduction in package self inductance (Better electrical performance) due to "floating ground plane" effect of heat slug
• Available in die-up and die-down configurations
• Capable of 25-30 watts with external heatsink

Thermal Resistance:

Multi-Layer PCB, Pre-JEDEC Standard Test Boards

Theta JA (°C/W) by Velocity

Pkg	Body Size (mm)	Pad Size (mm)	0	200	500
100 ld	14 x 20	11	20.7	17.7	16.1
208 ld	28 x 28	11	13.8	11.5	10.3

Electrical:

Simulated Results @100 MHz

Pkg	Body Size (mm)	Pad Size (mm)	Lead	Inductance (nH)	Capacitance (pF)	Resistance (m)
100 ld	14 x 20	8 x 8	Longest	6.310	1.040	51.7
100 ld	14 x 20	8 x 8	Shortest	2.900	0.606	29.0
208 ld	28 x 28	9.5 x 9.5	Longest	12.000	1.730	95.5
208 ld	28 x 28	9.5 x 9.5	Shortest	6.850	1.470	81.0

Reliability:

MQFP PowerQuad^® 4 is assembled with proven reliable performance.

Autoclave:	121 °C, 2 atm, 504 hours
Temp / Humidity:	85 °C/30%RH, 1000 hours
High temp storage:	150 °C, 1000 hours
Temp cycle:	-65/+150 °C, 1000 cycles

Process Highlights:

Die Thickness (max):	25 mil
Strip Solder plating:	85/15 Sn/Pb
Marking:	Pad
Lead inspection:	Laser/Optical
Pack/ship options:	Bar code/Dry pack

Test Services:

Contact Amkor Test Services for more details.

• Program generation / conversion
• Product engineering support
• Wafer sort