The MQFP PowerQuad^® 2 is patented, advanced IC packaging technology with excellent attributes in thermal and electrical performance. Extraordinary gains in power dissipation and speed are achieved through the use of an innovative, integrated, embedded copper heatsink. The IC is attached directly to this large, highly efficient heatsink which readily extracts generated heat under demand situations. To enhance the thermal conduction from the IC to the mounting surface, the internal package leads are mechanically connected, yet electrically isolated, by a proprietary process to the heatsink. Thermal resistance improvements greater than 100% can be realized with this technology and without the use of any external cooling aids! The large heatsink also provides a "floating" ground plane to the signal leads, reducing self-inductance by 50% (over conventional plastic QFPs).

Additionally, the patented PQ2 heatsink has integrated mechanical "locking" features to ensure package integrity while eliminating moisture penetration. The end result is a high-power, high-speed IC package with the properties to enable new electronic products and emerging end applications to move from concept to production.

Applications:

Major semiconductor packaging engineers and manufacturers have chosen PowerQuad^® 2 as the IC package of choice for advanced, power micr processors, DSPs, high-speed logic / FPGAs, PLDs, ASICs, digital signal processor (DSP), automotive devices, thin low airflow high perfomrance applications and other similar technologies. System designers and OEM product developers find PQ2 solves power / thermal / speed concerns while supporting system constraints (standard package outlines, cost, SMT capability, product availability, technical support). PQ2 is ideal for: PCs, notebooks, high-end audio / video, power supplies, VME CPU board systems, workstations, RISC engine modules, GUI boards and many other applications.

Features:

Exceptional thermal and electrical performance by design include the following:

• Very high conductive, solid copper heatsink
• 50% reduction in package self inductance (Better electrical performance) due to "floating ground plane" effect of heat slug
• 64 - 304 lead counts (14 x 14 mm to 40 x 40 mm body size)
• Industry-accepted JEDEC package outlines
• Low stress mold compound
• Heatsink-up and heatsink-down configurations available
• ~100% improvement in Theta JA over standard MQFP
• Available in die-up and die-down configurations
• Capable of 25-30 watts with external heatsink

Mechanical Samples:

For mechanical samples of our MQFP PowerQuad^® 2 package, please click here.

Thermal Resistance:

Multi-Layer PCB

Theta JA (°C/W) by Velocity

Pkg	0	200	500
100 ld	17.6	14.7	13.3
208 ld	12.6	10.4	9.2
240 ld	11.8	9.6	8.4
304 ld	10.3	8.4	7.2

Electrical:

Simulated Results @100 MHz

Pkg	Body Size (mm)	Lead	Inductance (nH)	Capacitance (pF)	Resistance (m)
100 ld	14 x 20	Longest	4.550	1.230	60.1
100 ld	14 x 20	Shortest	2.560	0.768	26.9
208 ld	28 x 28	Longest	8.740	1.970	100.0
208 ld	28 x 28	Shortest	5.310	1.590	73.5
240 ld	32 x 32	Longest	7.710	1.580	87.8
240 ld	32 x 32	Shortest	4.900	1.180	57.3
304 ld	40 x 40	Longest	12.200	2.650	144.0
304 ld	40 x 40	Shortest	7.280	2.040	93.5

Reliability:

Reliability is of prime importance and long-term performance is assured by advanced designs, manufacturing process and materials.

Autoclave:	121 °C, 2 atm, 504 hours
Temp / Humidity:	85 °C/85% RH, 1000 hours
High temp storage:	150 °C, 1000 hours
Temp cycle:	-65/+150 °C, 1000 cycles

Process Highlights:

Die Thickness (max):	25 mil
Strip Solder plating:	85/15 Sn/Pb
Marking:	Pad
Lead inspection:	Laser/Optical
Pack/ship options:	Bar code/dry pack

Test Services:

Contact Amkor Test Services for more details.

• Program generation / conversion
• Product engineering support
• Wafer sort

Shipping:

• Low profile tray (JEDEC Outline CS-004)

Configuration Options:

Additional Information:

Description	File Type	File Size
MQFP PowerQuad® 2 Data Sheet		393 kb

For more information on the MQFP PowerQuad^® 2 package, please contact an Amkor Regional Sales Office near you, your Account Manager or fill out the Request for Additional Information Form.