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MicroLeadFrame ® (MLF ® / QFN / DFN / LFCSP)
Leadframe CSP - High Performance, Cost Efficient
 Amkor's MicroLeadFrame® (QFN - Quad Flat No-Lead package) is a near CSP plastic encapsulated package with a copper leadframe substrate. This package uses perimeter lands on the bottom of the package to provide electrical contact to the PWB. The package also offers Amkor's ExposedPadTM technology as a thermal enhancement by having the die attach paddle exposed on the bottom of the package surface to provide an efficient heat path when soldered directly to the PWB. This enhancement also enables stable ground by use of down bonds or by electrical connection through a conductive die attach material. TAPP
MLF Offerings:
- Chip-on-Lead (COL)
- Dual Row (Up to 164 I/O)
- Multi Chip Package
- Non-Exposed Pad
- PPF (NiPd) Punch MLF
- Small MLF (Less than 2 x 2 body size)
- Solder Die Attach
- Stacked Die
- Thin MicroLeadFrame
- Top Exposed Pad (TEP)
Dual Row MLF Package:
An MLF® package with 2 rows of lands — a cost effective, high performance solution for devices requiring up to 164 I/O. Typical applications include hard disk drives, USB controllers, and Wireless LAN.
Applications:
The small size and weight along with excellent thermal and electrical performance make the MicroLeadFrame® package an ideal choice for handheld portable applications such as cell phones and PDAs or any other application where size, weight and package performance are required issues.
Features:
- Small size (reduce package footprint by 50% or more and improved RF performance) & weight
- Standard leadframe process flow and equipment
- Excellent thermal and electrical performance
- 0.6 mm to 1.5 mm maximum height
- 4 to 164 I/O
- 1 - 12 mm Body size
- Thin profile and superior die to body size ratio
- Pb Free / Green
- Flexible Designs and High Yields
Mechanical Samples:
- For mechanical samples of our MicroLeadFrame® (MLF®) package, please click here.
- For mechanical samples of our MicroLeadFrame® (MLF®) Dual Row package, please click here.
- For MicroLeadFrame® (MLF®) Test PC Board and Kits, please click here.
Electrical:
Simulated results @ 2GHz. Values dependant on specific die and wire configurations
| Pkg |
Body Size (mm) |
LO |
(nH) |
(pF) |
(m ) |
| 12 ld |
3 x 3 |
Longest |
0.564 |
0.203 |
141.8 |
| 12 ld |
3 x 3 |
Shortest |
0.531 |
0.220 |
138.9 |
| 44 ld |
7 x 7 |
Longest |
1.766 |
0.326 |
315.1 |
| 44 ld |
7 x 7 |
Shortest |
1.194 |
0.289 |
234.5 |
| 64 ld |
10 x 10 |
Longest |
2.179 |
0.518 |
337.5 |
| 64 ld |
10 x 10 |
Shortest |
1.475 |
0.409 |
250.8 |
Thermal Resistance:
Modeled data @ 0 air flow / JEDEC Multi-layer PCB
| Pkg |
Body Size (mm) |
Board Vias # |
Exposed Pad (mm) |
Die (mm) |
Theta JA (°C/W) |
| 12 ld |
3 x 3 |
1 |
1.25 |
1.25 |
61.1 |
| 28 ld |
5 x 5 |
9 |
2.7 |
2.54 |
34.8 |
| 44 ld |
7 x 7 |
16 |
4.8 |
3.81 |
24.4 |
| 52 ld |
8 x 8 |
25 |
6.1 |
5.08 |
20.9 |
| 64 ld |
10 x 10 |
36 |
7.1 |
2.79 |
29.4 |
| 124 ld |
10 x 10 |
36 |
7.1 |
2.79 |
30 |
Reliability:
Amkor’s MicroLeadFrame® Packages are reliability assured through optimized design, material and process enabling high performance operation of your IC amp.
| Moisture sensitivity Caracterization: |
JEDEC Level 1 (depending on body size) 85°C / 85%, 168 hours |
| Temp / Humidity: |
85°C / 85% RH, 1000 hours |
| HAST: |
130°C, 85% RH, 96 hours |
| High temp storage: |
150°C, 1000 hours |
| Temp cycle: |
-65 / +150°C, 1000 cycles |
Process Highlights:
| Die Thickness: |
.25 ± .05 nominal, thinner for special applications |
| Plating: |
85/15 Sn/Pb, Matte Sn, NiPd |
| Marking: |
Laser |
Standard Materials:
| Leadframe: |
Copper Alloy, Dual Gauge |
| Die attach: |
Conductive Epoxy |
| Wire: |
1.0 mil low loop |
| Mold compound: |
Pb free / Green Capable |
Test Services:
- Program generation / conversion
- Product engineering support
- Available test / handling technology
- Tape and Reel Services
- Burn-in capabilities
Shipping:
- This product is shipped in clear anti-static tubes, bakable trays or metal canisters.
Configuration Options:
Body Size (mm) |
QFN Leadcounts
0.8, 0.65, 0.5, 0.4 mm Pitch |
DFN / SON Leadcounts
1.27, 0.95, 0.5 mm Pitch |
Dual Row Leadcounts
0.5 mm Pitch |
< 2 x 2 (saw only) |
- |
4 / 6 / 8 |
- |
2 x 3 |
- |
6 / 8 |
- |
3 x 3 |
4 / 8 / 10 / 12 / 16 |
8 / 10 |
- |
4 x 4 |
12 / 16 / 20 / 24 / 28 |
- |
- |
5 x 5 |
16 / 20 / 28 / 32 / 36 |
- |
44 / 52 |
6 x 5 |
36 |
8 |
- |
6 x 6 |
20 / 28 / 36 / 40 / 48 |
- |
60 / 68 |
7 x 7 |
28 / 32 / 44 / 48 / 56 |
- |
76 / 84 |
8 x 8 |
32 / 40 / 52 / 56 / 68 |
- |
92 / 100 |
9 x 9 |
36 / 44 / 60 / 64 / 76 |
- |
108 / 116 |
10 x 10 |
44 / 52 / 68 / 72 / 88 |
- |
124 / 132 |
11 x 11 |
- |
- |
140 / 148 |
12 x 12 |
48 / 60 / 84 / 88 / 100 |
- |
156 /164 |
Additional Information:
| Description |
File Type |
File Size |
| MicroLeadFrame® Data Sheet |
|
203 kb
|
| FusionQuad™ Data Sheet |
|
319 kb
|
| MicroLeadFrame® Packaging Process |
|
750 kb
|
Application Notes for Surface Mount
Assembly of Amkor’s MicroLeadFrame®
(MLF) Packages |
|
133 kb
|
For more information on the MicroLeadFrame®, Small MicroLeadFrame® or Dual Row MicroLeadFrame® package, please contact an Amkor Regional Sales Office near you, your Account Manager or fill out the Request for Additional Information Form. |
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