LQFP PowerQuad^® 4 (PQ4) is the same Amkor patented, advanced IC packaging technology used in MQFP PQ4s but applied to Low Profile 1.4 mm QFPs (LQFP). Improved power dissipation is achieved by using an exposed copper heatslug. This large copper heat slug extracts generated heat from the leadframe to which the IC is attached. Thermal resistance improvements of approximately 30% (over a standard LQFP) can be realized with this IC package without the use of any external cooling aids! In addition, the patented LQFP PQ4 heatsink has integrated mechanical “locking” features to ensure total package integrity and eliminates moisture penetration. The end result is a high-power, high-speed IC package with the properties to enable new, smaller, denser, portable electronic products and emerging end applications to operate with more features and greater reliability.

Applications:

Major semiconductor manufacturers and packaging engineers have chosen LQFP PQ4 as the IC package of choice for power microprocessors, controllers, DSPs, high speed logic/FPGAs, PLDs, ASICs, digital signal processor (DSP), automotive devices, thin low airflow high perfomrance applications and other advanced technologies. System designers and OEM product developers find the LQFP PQ4 solves power, thermal and speed concerns while supporting system constraints (standard package outlines, cost, SMT capability, product availability, technical support) in uses such as: laptops, notebooks, telecom, cordless/wireless, high-end audio/video, CPU / GUI board systems and many other small form-factor applications.

Features:

High-performance operation and attributes of the LQFP PowerQuad^® 4 include the following:

• High conductive, solid exposed heatsink
• 1.40 mm body for lightweight, portable applications
• 50% reduction in package self-inductance (Better electrical performance) due to "floating ground plane" effect of heat slug
• 50% improvement in Theta Ja over standard MQFP
• 44 to 128 lead counts
• 10 x 10 - 14 x 14 mm body sizes (JEDEC standard packages MS-026)
• Heatsink-up and down configurations available
• Available in die-up and die-down configurations
• Capable of 25-30 watts with external heatsink

Mechanical Samples:

For mechanical samples of our LQFP PowerQuad^® 4 package, please click here.

Thermal Resistance:

Multi-Layer PCB, Pre-JEDEC Standard Test Boards

Theta JA (°C/W) by Velocity

Pkg	Body Size (mm)	Pad Size (mm)	0	200	500
48 ld	7 x 7	5.0	42.5	36.8	34.4
64 ld	10 x 10	7.5	34.8	28.9	26.4
100 ld	14 x 14	9.5	23.2	12.8	15.8

Reliability:

Advanced design, manufacturing processes and materials assure long-term reliable performance.

Autoclave:	121 °C, 2 atm, 168 hours
Thermal shock (liq):	-65/+150 °C, 1000 cycles
Temp / Humidity:	85 °C/85%RH, 1000 hours
High temp storage:	150 °C, 1000 hours
Temp cycle:	-65/+150 °C, 1000 cycles

Process Highlights:

Die Thickness (max):	15.0 mils
Strip Solder plating:	85/15 Sn/Pb
Marking:	Pad
Lead inspection:	Laser/Optical
Pack/ship options:	Bar code/dry pack

Test Services:

Contact Amkor Test Services for more details.

• Program generation/conversion
• Product engineering support
• Wafer sort
• 256 Pin x 20 MHz test system available
• -55 °C to +165 °C test available
• Burn-in