LQFP PowerQuad^® 2 (PQ2) is the same Amkor patented, advanced IC packaging technology used in plastic QFPs but applied to Low Profile 1.4 mm QFPs (LQFP). This breakthrough in IC packaging provides extraordinary gains in power dissipation and speed through the use of innovative integrated, embedded copper heatsink. The IC is attached directly to the large, highly-efficient copper heatsink which readily dissipates generated heat. To enhance the thermal conduction from the IC to the mounting surface, the LQFP PQ2 package leads are mechanically connected, yet electrically isolated, to the heatsink by a proprietary process.

Thermal resistance improvements greater than 55% are realized with this technology and without the use of any external cooling aids! The large heatsink also provides a “floating” ground plane to the signal leads of the package thereby reducing self-inductance by 50% over conventional plastic LQFPs. In addition, the patented LQFP PQ2 heatsink has integrated mechanical “locking” features to ensure total package integrity and eliminates moisture penetration. The end result is a high-power, high-speed IC package with the properties to enable new, smaller, denser, portable electronic products and emerging end applications to move from concept to production.

Applications:

Major semiconductor manufacturers and packaging engineers have chosen LQFP PQ2 as the IC package of choice for power microprocessors, controllers, DSPs, high speed logic / FPGAs, PLDs, ASICs, digital signal processor (DSP), automotive devices, thin low airflow high performance applications and other advanced technologies. System designers and OEM product developers find the LQFP PQ2 solves power, thermal and speed concerns while supporting system constraints (standard package outlines, cost, SMT capability, product availability, technical support) in uses such as: laptops, notebooks, telecom, cordless / wireless, high-end audio/video, CPU / GUI board systems and many other small form-factor applications.

Features:

High-performance operation and attributes of the LQFP PowerQuad^® 2 include the following:

• High conductive, solid exposed heatsink
• 1.40 mm body for lightweight, portable applications
• Direct die attach to heatsink
• 50% reduction in package self-inductance (Better electrical performance) due to "floating ground plane" effect of heat slug
• 50% improvement in è Ja over standard MQFP
• 32 to 144 lead counts
• 7 x 7 - 20 x 20 mm body sizes (JEDEC standard packages MS-026)
• Heatsink-up and down configurations available
• Available in die-up and die-down configurations
• Capable of 25-30 watts with external heatsink

Mechanical Samples:

For mechanical samples of our LQFP PowerQuad^® 2 package, please click here.

Thermal Resistance:

Single-Layer PCB, Pre-JEDEC Standard Test Boards

Theta JA (°C/W) by Velocity

Pkg	Body Size (mm)	Pad Size (mm)	0	200	500
100 ld	14 x 14	8.4	34.1	26.8	22.7
208 ld	28 x 28	14.0	20.4	15.6	13.3

Thermal Resistance:

Multi-Layer PCB, Pre-JEDEC Standard Test Boards

Theta JA (°C/W) by Velocity

Pkg	Body Size (mm)	Pad Size (mm)	0	200	500
100 ld	14 x 14	8.4	18.1	15.5	14.1
208 ld	28 x 28	14.0	12.8	10.4	9.3

Reliability:

Advanced design, manufacturing processes and materials assure long-term reliable performance.

Autoclave:	121 °C, 2 atm, 168 hours
Thermal shock (liq):	-65/+150 °C, 1000 cycles
Temp / Humidity:	85 °C/85%RH, 1000 hours
High temp storage:	150 °C, 1000 hours
Temp cycle:	-65/+150 °C, 1000 cycles

Process Highlights:

Die Thickness (max):	15.0 mils
Strip Solder plating:	85/15 Sn/Pb
Marking:	Pad
Lead inspection:	Laser/Optical
Pack/ship options:	Bar code/dry pack/TNR

Test Services:

Contact Amkor Test Services for more details.

• Program generation/conversion
• Product engineering support
• Wafer sort
• 256 Pin x 20 MHz test system available
• -55 °C to +165 °C test available
• Burn-in