Amkor offers a broad line of LQFP IC packages designed to provide the same great benefits as MQFP packaging with a 1.4 mm body thickness. This allows IC packaging engineers, component specifiers and systems designers to solve issues such as increasing board density, die shrink programs, thin end-product profile and portability.

Applications:

Amkor’s LQFPs are an ideal IC package for most IC semiconductor technologies such as ASIC, DSP, controllers, processors, gate arrays (FPGA / PLD), SRAMs and PC chip sets.

LQFPs are particularly suited for light weight, portable electronics requiring broad performance characteristics. Such applications are lap-top PCs, video / audio, telecom, cordless / RF, data acquisition, office equipment, disc drives and communication boards.

Features:

Amkor’s LQFP packaging portfolio provides:

• 7 x 7 mm to 28 x 28 mm body size
• Copper leadframes
• Custom leadframe design available
• Low stress die attach adhesive
• Power enhancement version - PowerQuad
• 32 to 256 lead counts
• Broad selection of die pad sizes
• 1.4 mm body thickness
• Rapid cure mold compound

Reliability:

IC chips are assembled in optimized package designs with proven reliable semiconductor materials.

Moisture sensitivity characterization:	JEDEC Level 3,  30°C / 60% RH, 192 hrs
PCT:	121 °C, 100%RH, 2 atm, 504 hours
High temp storage:	150 °C, 1000 hrs.
Temp/Humidity:	85 °C/85% RH, 1000 hours
Temp cycle:	-55/+125 ° C, 1000 cycles

Process Highlights:

Die thickness:	14.5 ± .5 mil
Strip Solder plating:	85/15 Sn/Pb
Marking:	Laser
Lead inspection:	Laser / Optical
Pack/ship options:	Bar code, dry pack
Wafer backgrinding:	Available

Test Services:

• Program generation / conversion
• Product engineering support
• Wafer sort
• Burn-in
• -55°C to + 165°C test available
• 256 pin x 20 MHz test system available