RF / Wireless Package Design
From RF Power Amplifiers to full 802.11 modems, Amkor is committed to enabling our customers through our interactive RF Design and Applications Services. We help you optimize the cost, size and performance in your product choices and provide RF design services to improve your cycle time. Amkor RF design engineers know what our customers concerns are and how to achieve them. After all, our engineers have come from the ranks of RF and microwave product design organizations ranging from hybrid modules to handsets.
System in Package (SiP) Solutions
As with System on Chip (SoC), Amkor's SiP technology is an ideal solution in markets that demand smaller size with increased functionality. However, SiP has the added benefit of compatibility with die design changes and integration of various die technologies (e.g., Si, GaAs, SiGe, SOI, MEMS) without the high cost and lead time associated with SoC development and manufacturing. Amkor Technology has leveraged its single chip assembly and test technology into SiP development.
Press Releases
| 11/20/09 | Amkor to Present at Credit Suisse Technology Conference |
| 11/02/09 | ITC Reaffirms Ruling that Carsem Infringes Amkor MLF Patent |
| 10/27/09 | Amkor Reports Third Quarter 2009 Results |
| 10/23/09 | Nakaya, Amkor and Toshiba Sign Definitive Agreements on Joint Venture for Semiconductor Assembly and Test Services |
| 10/14/09 | Amkor Technology to Announce Third Quarter 2009 Financial Results on October 27, 2009 |
Data Sheets
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