Through Mold Via (TMV®) Solutions
Amkor introduced the next generation PoP solution with new technologies to create interconnect vias through the mold cap, naming this technology Through Mold Via (TMV®). TMV® technology provides a stable bottom package that enables use of thinner substrates with a larger die to package ratio. TMV® enabled PoP can support single, stacked die or flip chip designs. TMV® is an ideal solution for the emerging 0.4mm pitch low power DDR2 memory interface requirements and enables the stacked interface to scale with solder ball pitch densities.
Through Silicon Via (TSV) Solutions
Through Silicon Via (TSV) interconnects are emerging to serve a wide range of 3D packaging applications and 3D IC architectures that demand higher levels of performance and silicon integration. To enable the use of TSVs in these 3D applications, a number of back-end technology platforms are being developed or deployed for high volume processing. Amkor is focused on developing technology solutions for the back end processing of Through Silicon Via based wafers, also referred to as wafer finishing, and 3DIC architectures assemblies.
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Wafer Level Packaging Solutions (DSBGA | WLCSP | WLP)CSPnl is a true wafer level CSP package that can incorporate thin film redistribution films to route I/O pads to JEDEC / EIAJ standard pitches, and thereby avoid the need to redesign legacy parts for CSP applications. It is available in two options: Bump on Repassivation (BOR) and Bump on Redistribution (RDL). By integrating our CSPnl™ packaging technology with existing die processing and testing services as well as new die processing technologies Amkor is able to offer you a full turnkey solution for wafer level products. |
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Press Releases
| 02/02/12 | Amkor Technology to Announce Fourth Quarter and Full Year 2011 Financial Results on February 9, 2012 |
| 12/20/11 | Sales of Amkor Technology’s Next Generation Through Mold Via Package-on-Package Solutions Surpass 100 Million Units |
| 11/21/11 | Amkor Technology to Present at Credit Suisse Technology Conference |
| 11/14/11 | Toshiba and Amkor Jointly Agree to Postpone Discussions for Acquisition of Toshiba’s Malaysian Semiconductor Assembly and Test Operations Due to Thailand Flooding |
Data Sheets
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